Accumold Goes To SMT Hybrid Packaging & Microelectronics In Nuremberg


ANKENY, Iowa – The SMT Hybrid Packaging conference and exposition integration in Nuremberg, Germany is still one month away but the Accumold marketing team is gearing up for its first-ever appearance at Europe’s leading event on microelectronics system integration.


Accumold Marketing Team

Accumold Marketing Team ready to show off microelectronics technology.

“We normally try to add a conference and exposition or two to our itinerary each year. While this event is a new one for us, system integration in microelectronics is very familiar territory for everyone at Accumold,” said Aaron Johnson, Vice President of Marketing and Customer Strategy. “It turns out that the timing is terrific for our marketing team and it’s another one of those great opportunities to share the story of Accumold’s unique capabilities and create some new, mutually beneficial relationships.”


SMT Hybrid Packaging, which opens its three-day run on June 5, is the only event in Europe that “takes a comprehensive view of system integration in microelectronics ‒ from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies,” according to its sponsor, Messe Frankfurt Group.

Johnson noted he’s also looking forward to his role as a conference speaker. He will be delivering his presentation ‒ “The Five Essentials of Micro Molding” ‒ on the conference’s first morning.

Since 1985, Accumold has produced ultra-precise, plastic injection-molded components, found in micro-electronics, cell phones, telecommunications, surgical tools, hearing aids, medical devices, antennas, connectors and more. The company handles volumes from prototypes to millions per year while maintaining consistent, precise tolerances that are unique in the industry.

Our History

Click here to learn about why Accumold is a micro mold leader in microelectronics manufacturing.

micromolding components next to EU coins.

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