Month: May 2018


Accumold Goes To SMT Hybrid Packaging & Microelectronics In Nuremberg

ANKENY, Iowa – The SMT Hybrid Packaging conference and exposition integration in Nuremberg, Germany is still one month away but the Accumold marketing team is gearing up for its first-ever appearance at Europe’s leading event on microelectronics system integration.   “We normally try to add a conference and exposition or two to our itinerary each…